Significantly reduce tact time with continuous dispensing! The ultra-precision dispenser device 'Quspa-LX' enables high-precision fine dispensing.
A new model of our ultra-precision dispenser device series 'Quspa', widely adopted in substrate mounting and underfill processes in semiconductors, has been released.
It demonstrates excellent positional accuracy even during high-speed continuous dispensing, reducing the tact time by up to approximately 50% compared to conventional stop-and-go application (theoretical value). This contributes to improved productivity. *Compared to our conventional models.
It also achieves high-precision solder jet application within a diameter of ±20μm. It is compatible with various dispensing materials, including epoxy thermosetting resins, cream solder, and silicone-based thermosetting resins.
[Features]
■ Achieves astonishing miniaturization: Cream solder at 110μm, epoxy thermosetting resin at 80μm, UV adhesive at 100μm, etc.
■ Improved dynamic positional accuracy: Application position accuracy within 3σ10μm (during non-stop jet application).
■ High-speed network: Network processing speed improved by 16 times (theoretical value).
■ Tact time reduction: Significant reduction in tact time due to improved processing speed.
■ GUI iconization: Intuitive screen operation possible.
■ Supports more workpieces: Standard equipped with coaxial displacement sensors.
*For more details, please download the materials or contact us.
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